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design-electromagnetic-device

pjt222
Updated 6 days ago
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Metadesign

About

This Claude Skill designs practical electromagnetic devices like motors, generators, transformers, and electromagnets by applying theory to application. It helps developers size components for target fields or forces, select motor topologies, compute performance metrics, and analyze power losses. Use it when you need to bridge electromagnetic principles with concrete design parameters and efficiency calculations.

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Documentation

設電磁器

立效需→擇式→算參→析耗→驗度熱飽之限。

  • 量電磁鐵(筒或環)為場、吸力、持力
  • 擇馬達式(DC 刷、BLDC、步進、感應)算矩、速、效
  • 設發電機為定壓、流、頻
  • 設變壓器為定比、功、頻
  • 析並減耗:銅(I^2 R)、芯(磁滯、渦流)、漏通

  • :器類(磁鐵、馬達、發電、變壓)
  • :效需(場強、力、矩、壓比、功、效標)
  • :運條(壓、流、頻、占比、環溫)
  • :芯材偏好(矽鋼、鐵氧、粉鐵、空芯)+ B-H 數
  • :體積、重之限
  • :價、造之限

一:立需與運條

擇式前盡定設計標:

  1. 首效量:一最要之需:

    • 磁鐵:定點之 B(Tesla)或吸力(Newton)
    • 馬達:額矩(N.m)、額速(RPM)或功(W)
    • 發電:額速下之壓(V)、流(A)、頻(Hz)
    • 變壓:原次壓、功(VA)、運頻
  2. 次需:效標(%)、環之上溫升(K)、占比(連續、斷續、脈衝)、體(徑、長、重)。

  3. 源限:可得之壓、流、頻(DC 或 AC 定 Hz)、波形(正弦、PWM、梯形)。

  4. 境條:環溫域、冷法(自對流、強風、液)、海拔(影風冷)、震擊求。

## Design Requirements
- **Device type**: [electromagnet / motor / generator / transformer]
- **Primary specification**: [value with units]
- **Efficiency target**: [%]
- **Supply**: [voltage, current, frequency]
- **Thermal limit**: [max temperature rise in K]
- **Size constraint**: [dimensions or weight]
- **Duty cycle**: [continuous / intermittent (on-time/off-time) / pulsed]

得:諸需皆有量值與單位,無含糊。

敗:需相衝(如小體大矩高效)→明指權衡請設計者排序。電磁器遵基本縮放律:力隨體、耗隨面、熱限囿功密。

二:擇式

選合需之器構:

  1. 磁鐵諸式

    • 筒(柱):簡捲,內均場 B = mu_0 n I(長筒)。宜均場用。氣隙則為吸用。
    • :無外漏場(通盡含)。宜需減漏場。部捲則不如筒均。
    • C 芯/E 芯:小體高力。隙聚力。繼電及持磁之標。
    • Helmholtz 對:二圈隔一徑。中心域極均場。宜校驗及測。
  2. 馬達諸式

    • DC 刷:驅簡(加 DC 壓),低速矩佳。刷限壽、速。矩:T = k_T * I。
    • BLDC:電子換相,壽速勝刷。梯形或正弦驅。今之主。
    • 步進:精確開迴定位(離散步,常 1.8 或 0.9 度)。連矩遜 BLDC。宜無反饋之位。
    • AC 感應:堅,無永磁,構簡。速依源頻與滑。工業之主。
  3. 發電諸式:馬達逆用。BLDC 馬達→BLDC 發電(反電動勢為出)。感應馬達超同步速→感應發電。小規模(風、水)偏永磁發電。

  4. 變壓器諸式

    • 芯式:捲在矩芯一肢。電力變壓之標。
    • 殼式:芯圍捲。磁蔽勝。高功用。
    • 環式:無隙、低漏、緊湊。捲價高。音及靈敏電用。
    • Planar/PCB:捲為 PCB 跡。低輪廓。高頻開關電源用。
## Topology Selection
- **Topology chosen**: [specific configuration]
- **Justification**: [why it matches the requirements]
- **Key advantages**: [for this application]
- **Key limitations**: [and mitigation strategy]
- **Alternatives considered**: [and why rejected]

得:繫步一之需而證之擇,含承認限。

敗:無標式合諸需→考混式(如 Halbach 列,少材高場)或鬆次限。書權衡。

三:算設計參

由電磁原理算體尺及電參:

  1. 磁鐵參

    • 匝:N = B * l_core / (mu_0 * mu_r * I)(筒長 l_core),或由磁路:N * I = Phi * R_total
    • 線規:選合流密 J(連續 3-6 A/mm^2,斷續至 15 A/mm^2)。線截 A_wire = I / J。
    • 芯截:A_core = Phi / B_max,B_max 在飽和下(矽鋼 1.5-1.8 T,鐵氧 0.3-0.5 T)
    • 隙吸力:F = B^2 * A_gap / (2 * mu_0)(Maxwell 應力張量)
    • 捲阻:R = rho_Cu * N * l_mean_turn / A_wire
  2. 馬達參

    • 矩常:k_T = (2 * B * l * r * N) / (相數)(簡化 BLDC)
    • 反電動勢常:k_E = k_T(SI 中同值)
    • 額流:I_rated = T_rated / k_T
    • 空載速:omega_no_load = V_supply / k_E
    • 捲阻由線規及均匝長
  3. 變壓器參

    • 匝比:N_1 / N_2 = V_1 / V_2
    • 芯截:A_core = V_1 / (4.44 * f * N_1 * B_max)(正弦激)
    • 原匝:N_1 = V_1 / (4.44 * f * B_max * A_core)
    • 窗面:A_window = (N_1 * A_wire1 + N_2 * A_wire2) / k_fill(k_fill 常 0.3-0.5)
    • 芯體:V_core = A_core * l_mean_path
  4. 磁路析:含芯與隙之器:

    • 芯磁阻:R_core = l_core / (mu_0 * mu_r * A_core)
    • 隙磁阻:R_gap = l_gap / (mu_0 * A_gap)(小隙遠大於 R_core)
    • 總磁阻:R_total = R_core + R_gap(串)或 1/R_total = sum(1/R_i)(並)
    • 通:Phi = N * I / R_total
## Design Parameters
- **Turns**: N = [value] (primary), N_2 = [value] (if applicable)
- **Wire gauge**: AWG [number] (diameter [mm], area [mm^2])
- **Core dimensions**: A_core = [mm^2], l_core = [mm], l_gap = [mm]
- **Core material**: [type], B_max = [T], mu_r = [value]
- **Winding resistance**: R = [Ohms]
- **Operating current**: I = [A], current density J = [A/mm^2]
- **Key performance**: [B-field / torque / voltage ratio = calculated value]

得:諸體尺及電參有量值,由電磁式推,每步查單位。

敗:所需匝不容於捲空→增芯(大窗)、細線(高密增熱)、減效標。芯超 B_max→增芯截或加匝。

四:析耗與效

量諸耗機並算總效:

  1. 銅耗(I^2 R)

    • P_Cu = I^2 * R_winding(DC 阻耗)
    • 高頻宜計趨膚:R_AC / R_DC 增(線徑 > 2 * delta)
    • 多層捲之臨近效進增 AC 阻
    • 減:用 Litz 線(細絕線絞)於 > ~10 kHz
  2. 芯耗(磁滯+渦流)

    • 單位體每週磁滯耗:W_h = B-H 環面
    • 磁滯功:P_h = k_h * f * B_max^n * V_core(Steinmetz,n 常 1.6-2.0)
    • 渦流功:P_e = k_e * f^2 * B_max^2 * t^2 * V_core(t = 疊片厚)
    • 合(廣義 Steinmetz):P_core = k * f^alpha * B_max^beta * V_core
    • 減:疊芯(50/60 Hz 常 0.25-0.5 mm,高頻更薄)、> 100 kHz 鐵氧芯
  3. 體構渦流耗

    • 漏通感生框、蔽、臨導之流
    • 尤大變壓、機之患
    • 減:非磁之體材、磁蔽
  4. 機械耗(馬達、發電):

    • 軸承摩:P_friction = T_friction * omega
    • 風耗(轉子空阻):P_windage 近 omega^3
    • 刷摩(DC 刷):磨損依項
  5. 算效

    • 磁鐵:效非主量;注功耗 P = I^2 R 於定場/力
    • 馬達:eta = P_mechanical / P_electrical = (T * omega) / (V * I)
    • 發電:eta = P_electrical / P_mechanical
    • 變壓:eta = P_out / P_in = P_out / (P_out + P_Cu + P_core)
    • 常效:小馬達 60-85%,大馬達 90-97%,變壓器 95-99%
## Loss Analysis
| Loss Mechanism | Formula | Value (W) | Fraction of Total |
|---------------|---------|-----------|-------------------|
| Copper (I^2R) | [expression] | [W] | [%] |
| Core hysteresis | [expression] | [W] | [%] |
| Core eddy current | [expression] | [W] | [%] |
| Mechanical (if applicable) | [expression] | [W] | [%] |
| **Total losses** | | [W] | 100% |

- **Efficiency**: eta = [%]
- **Temperature rise estimate**: Delta_T = P_total / (h * A_surface) = [K]

得:諸耗機皆量,總效已算,溫升估以驗熱可行。

敗:效低標→識主耗:銅主於小器(增線或減匝),芯主於高頻(換低耗芯材或減 B_max),機主於高速(改軸承)。溫升超限→增冷(風、散熱)或減功密。

五:對需及實限驗

驗計合諸需且體可成:

  1. 效驗

    • 由末設計參重算首量(B、力、矩、壓)
    • 驗符或超步一之需
    • 算裕:(達-求)/求 為百分比
  2. 飽和查

    • 驗芯之 B_max 在所擇材之飽通密下
    • 查磁路各段(芯肢、軛、隙外展)
    • 隙常最低通密;最小截之芯段最高
  3. 熱查

    • 估面溫:T_surface = T_ambient + P_total / (h * A_surface)
    • 自對流:h 近 5-10 W/(m^2.K)
    • 強風:h 近 25-100 W/(m^2.K)
    • 線絕緣級限:A(105 C)、B(130 C)、F(155 C)、H(180 C)
    • 芯 Curie 溫:矽鋼 ~770 C(罕為限)、鐵氧 ~200-300 C(可為限)
  4. 尺查

    • 驗計合於所定體
    • 查捲合於窗面及假填因
    • 查高壓之隙、爬電距
  5. 裕及敏

    • 算各關鍵參(流、匝、隙、芯磁導)+/-10% 對首量之變
    • 識最敏之參→主造公差
    • 含隙之設計,隙長幾皆最敏
## Design Validation
| Requirement | Target | Achieved | Margin |
|------------|--------|----------|--------|
| [Primary metric] | [value] | [value] | [%] |
| Efficiency | [%] | [%] | [%] |
| Temperature rise | < [K] | [K] | [K margin] |
| Envelope | [dimensions] | [dimensions] | [fits / exceeds] |

## Sensitivity Analysis
| Parameter | Nominal | +10% Effect on Primary Metric | Most Sensitive? |
|-----------|---------|-------------------------------|----------------|
| Current | [A] | [+/- %] | [Yes/No] |
| Turns | [N] | [+/- %] | [Yes/No] |
| Air gap | [mm] | [+/- %] | [Yes/No] |
| mu_r | [value] | [+/- %] | [Yes/No] |

得:諸需有書裕而符,熱可行已證,最敏參已識。

敗:需不符→調式(二)、參(三)、減耗策(四)迭代。熱不可行→減占比、增體(多面冷)、升絕緣級、加主動冷。書每迭。

  • 諸需有量值與單位
  • 擇式有證且記諸可替
  • 磁路析全(磁阻、通、NI 積)
  • 線規為合流密(連續 3-6 A/mm^2,斷續更高)
  • 芯在飽通密下有裕
  • 諸耗機皆量(銅、磁滯、渦流、機械)
  • 效符標
  • 溫升在絕緣級限內
  • 計合於體
  • 敏析識最緊公差之參
  • 計全足以造樣

  • 略磁路磁阻:實用器隙磁阻常主(1 mm 隙磁阻勝 100 mm 矽鋼芯)→無磁路模計之器遠遜望
  • 超芯飽運行:B-H 膝上增量磁導劇降→倍流不倍通→器「似停」→常查最窄芯截之 B_max
  • 銅線過細致熱:流密限乃熱限偽裝→10 A/mm^2 空中之線數分鐘過熱→連續運行宜在 5-6 A/mm^2 下,除非主動冷
  • 略隙外展通:通外展增效隙面→隙可比芯尺時外展可增 20-50%→略外展則低估通(高估 NI 積)
  • 高頻用 DC 阻:10 kHz 銅趨膚深約 0.66 mm→ > 1.3 mm 徑之磁線 AC 阻遠勝 DC 阻→高頻用 Litz 或並聯細絞
  • 馬達常 k_T 與 k_E 之單位惑:SI 中 k_T (N.m/A) 與 k_E (V.s/rad) 同值。k_E 若為 V/kRPM(數據表常)→換算:k_T [N.m/A] = k_E [V/kRPM] * 60 / (2 * pi * 1000)

  • analyze-magnetic-field
  • solve-electromagnetic-induction
  • formulate-maxwell-equations
  • simulate-cpu-architecture
  • analyze-tensegrity-system

GitHub Repository

pjt222/agent-almanac
Path: i18n/wenyan-ultra/skills/design-electromagnetic-device
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